Semiconductors play a critical role in enabling the widespread deployment of cloud, data-center and mobile technologies. The rapid growth of compute, networking and storage in the cloud, faster mobile and core bandwidths, sophisticated consumer devices, stronger security at decreasing cost and power are all enabled by improvements in chips.
The semiconductor industry is delivering these improvements using rapid evolution of architectures and standards, increased chip integration, higher I/O and DRAM bandwidth rates, latest process nodes going to 20nm and smaller, 3D transistor technologies for lower power consumption along with breakthrough multi-chip packaging capabilities.
At the same time, investment in new revolutionary semiconductor startups has plummeted in recent years (source: GSA). This does not bode well for long-term, disruptive innovation in the industry.
There are a few reasons for this trend:
- The cost of developing new silicon in latest process technology nodes from scratch is considerably larger compared to 7-8 years ago! Developing a competitive product requires a tremendous amount of functionality in one chip at the 28nm or 20nm process node (due to transistors being much smaller vs earlier nodes). This increases cost of intellectual property (IP) – whether it is developed in-house or licensed. Further, the cost of a mask-set for a new chip design in 28nm is in the $2M to $3M range, and consequently the penalty for any bugs/errors is significantly greater. In fact, the cost-per-transistor, which has declined consistently in every prior process node reduction, is expected to be same or higher as the industry transitions to 3D transistors at the 20nm process node.
- The time to develop a new product has increased due to the greater amount of IP required. In addition, the turn-around time is longer through the fab when using smaller geometries. Once silicon products become available, OEM customers then design systems using them and the revenue ramp really starts once the OEM customers start shipping. So time to revenue from development start for silicon products has continued to increase. This is in contrast to time between new software releases delivered through the cloud (e.g. Workday or Salesforce.com), which have reduced dramatically.
- Venture investors have a range of alternatives in areas such as consumer internet, cloud services, enterprise and infrastructure software and systems, where the investment and risk required to achieve profitability and liquidity is substantially lower. IPOs and acquisitions such as Workday, Nicira, Fusion-IO and Data Domain have delivered superior attractive returns on investment compared to silicon investments. In contrast, there have been few IPOs with similar profile in the semiconductor space over the last 5-6 years.
So, what does this mean for entrepreneurs, investors and the semiconductor industry going forward?
In examining the overall semiconductor industry, there are segments where new startups have an opportunity to develop breakthrough products, compete against large incumbents and deliver superior returns to entrepreneurs and investors. The characteristics of these segments include: new technology innovation (which is obvious), lack of need for latest process technology nodes and inability for incumbents to easily integrate functionality into existing or future products. Examples of these segments include:
- Analog products such as RF power-amplifiers and PHY technologies addressing newer applications/interfaces. Analog IP of significant size is hard to integrate into digital silicon dominated chips as it impacts the yields and is expensive. Analog IP also doesn’t shrink meaningfully in size (or cost) in going to the next process technology node. Additionally, in certain product areas such as 3G/4G RF power-amplifiers, existing silicon products utilize Gallium Arsenide process, which has higher cost and provides new entrants an opportunity with lower-cost bulk CMOS process technology. However, this transition is not trivial and requires solving several technology challenges.
- Sensor technologies: Almost every consumer product these days includes a variety of sensors such as touch sensors, motion sensors, pressure sensors, audio sensors & imaging sensors. Innovation in MEMS gyroscope technologies and a shift towards CMOS have opened opportunities for new entrants. In a number of cases, the leading process technology node is not required which keeps the required investment at an acceptable level. Moreover, incumbents delivering processors or wireless technology find it impractical or unfeasible to integrate sensors into their products.
To create startup opportunities in digital silicon chips that aim to deliver revolutionary innovation, we can learn from other industries. For example, in the software industry, a ground swell of open-source enabled startups to innovate in established segments such as OSs (to compete vs Microsoft) or databases (to compete vs Oracle). In the semiconductor industry, this will involve open-sourcing IP, developing open-source or low-cost CAD tools and provide equitable access to the fabs. Universities, government funding and individual initiatives of key engineers and leaders have to be the key drivers to make this happen. Established companies also need to confront this situation and look for creative solutions to develop revolutionary digital technologies outside of their existing roadmaps, processes and organizations. A thriving startup ecosystem across all segments is vital for a healthy, innovative, long-term future of the semiconductor industry!
